Mobile Phone, Tablet, TV Board, Set-top box etc.
LEENO can provide a System Level Test solution on various types of packages.
Package Type | 990PNSP, 216FBGA |
Pitch | 0.4mm |
Characteristics | AP + NAND Memory Test Type |
Package Type | 216BGA |
Pitch | 0.4mm |
Characteristics | Mobile Memory Test |
Package Type | 797FCCSP |
Pitch | 0.4mm |
Characteristics | Note Book |
LEENO’s 100% in-house manufacturing process provides our customers with the best quality & fast delivery.
From Precision Machining to Injection (Molding), Plating/Coating, and Assembly, our Total Manufacturing Processes provides the highest quality products with the shortest production/delivery time to ensure customer satisfaction.