Memory Device Test Socket
With advanced precision injection molding equipment & patented technologies, LEENO can provide various test sockets for all kinds of memory devices.
Specifications
- Package Type
- BGA, TSOP etc.
- Pitch
- ≥0.27mm
- Socket Type
- GPS (Device Alignment System), Floating Type, Hybrid BK Type
![]( https://leeno.com/wp-content/uploads/2023/12/20231222_112211꾸미기수정.jpg)
![]( https://leeno.com/wp-content/uploads/2023/12/20231222_112211꾸미기수정.jpg)