Using the spring contact probes for semiconductor package inspection, customers can test various types of packages with LEENO’s Total Interface Solution.
From fine pitch probe | |
Barrel Diameter | 0.08mm ~ |
Probe Length | A mm ~ 4.5mm ~ Z mm |
From fine pitch probe
Barrel Diameter 0.08mm ~
Probe Length A mm ~ 4.5mm ~ Z mm
RF probe | |
Barrel Diameter | 0.25mm ~ |
Probe Length | 0.85 mm ~ 1.23mm ~ Z mm |
LEENO’s 100% in-house manufacturing process provides our customers with the best quality & fast delivery.
From Precision Machining to Injection (Molding), Plating/Coating, and Assembly, our Total Manufacturing Processes provides the highest quality products with the shortest production/delivery time to ensure customer satisfaction.