Using the spring contact probes for semiconductor package inspection, customers can test various types of packages with LEENO’s Total Interface Solution.
|From fine pitch probe|
|Barrel Diameter||0.08mm ~|
|Probe Length||A mm ~ 4.5mm ~ Z mm|
From fine pitch probe
Barrel Diameter 0.08mm ~
Probe Length A mm ~ 4.5mm ~ Z mm
|Barrel Diameter||0.25mm ~|
|Probe Length||0.85 mm ~ 1.23mm ~ Z mm|
LEENO’s 100% in-house manufacturing process provides our customers with the best quality & fast delivery.
From Precision Machining to Injection (Molding), Plating/Coating, and Assembly, our Total Manufacturing Processes provides the highest quality products with the shortest production/delivery time to ensure customer satisfaction.