Probe Head
Kelvin probe head is designed using LEENO’s best processing technology. The Probe Head can have a long life span using optimized Kelvin spring probe contacts which also can be used for high current wafer testing. Fine pitch spring probes or Cobra pins can provide 92um pitch with greater than 30K points on the Probe Card.
Specifications
Package type
Wafer (WLCSP)
Pitch
92um~
Characteristics
Kelvin, Cobra, RF
Product Series
| 1 Die Bump Count | 3600 Bump |
| Pitch | 0.092mm |
| Characteristics | 1 Site, Spring Contact, Cobra Type |
| 1 Die Bump Count | 3600 Bump (More than 28000 Pin) |
| Pitch | 0.14mm |
| Characteristics | 8 Site, No Skip Cobra Type |
| 1 Die Bump Count | 12 Bump |
| Pitch | 0.4mm |
| Characteristic | 16 Site, 2-Die Skip, Mix Probe Type(Kelvin+Non Kelvin) |
| 1 Die Bump Count | 29 Bump |
| Pitch | 0.35mm |
| Characteristic | 8 Site, 1-Die Skip Kelvin Type |
| 1 Die Bump Count | 34 Bump |
| Pitch | 0.4mm |
| Characteristic | 8 Site, 2-Die Skip, Signal Length 2.05mm |
| 1 Die Bump Count | 14 Bump |
| Pitch | 0.4mm |
| Characteristic | 4 Site, No Skip Kelvin Type |
| 1 Die Bump Count | 60 Bump |
| Pitch | 0.4mm |
| Characteristic | 16 Site, 2-Die Skip, Signal Length 2.5mm |
| 1 Die Bump Count | 40 Bump |
| Pitch | 0.4mm |
| Characteristic | 8 Site, No Skip Kelvin Type |
| 1 Die Bump Count | 134 Bump |
| Pitch | 0.26mm |
| Characteristic | 4 Site, No Skip Air Coaxial Type |
