Memory Test Socket
Using advanced precision injection molding equipment and patented technology, LEENO can provide molded sockets for various package sizes for memory sockets.
Specifications
Package Type
BGA, TSOP etc.
Pitch
0.30P~
Customizing
GPS (Device Alignment System), Floating Type, Hybrid BK Type
Product Series
FLOATING TYPE
| P/N | 216BGA |
| Pitch | 0.4mm |
| Device Spec. | 216FBGA-12.0X12.0X1.02T |
| Socket Size | 27.0×17.0x4.65 |
GPS TYPE / GUIDE TYPE
| P/N | 288BGA |
| Pitch | 0.35mm |
| Device Spec. | 288FBGA-14.0X14.0X0.76T |
| Socket Size | 27.0×17.0x3.75 |
HYBRID BK TYPE / DEVICE GUIDE TYPE
| P/N | 546BGA |
| Pitch | 0.3mm |
| Device Spec. | 546FBGA-14.0X16.0X0.76T |
| Socket Size | 27.0×17.0x3.15 |
GPS TYPE / GUIDE TYPE
| P/N | 266BGA |
| Pitch | 0.3mm |
| Device Spec. | 266-FBGA-14X14X0.62T |
| Socket Size | 27.0×17.0x3.75 |
FLOTING TYPE / DEVICE GUIDE TYPE
| P/N | 383BGA |
| Pitch | 0.4mm |
| Device Spec. | 383FBGA-9.0X9.0X1.18T |
| Socket Size | 227.0×17.0x5.40 |
NAND FLASH MEMORY
| P/N | 48TSOP |
| Pitch | 0.5mm |
| Device Spec. | 48TSOP-1-20.0X12.4X1.20T |
| Socket Size | 28.4×19.0x4.75 |
