Using advanced precision injection molding equipment and patented technology, LEENO can provide molded sockets for various package sizes for memory sockets.
P/N | 216BGA |
Pitch | 0.4mm |
Device Spec. | 216FBGA-12.0X12.0X1.02T |
Socket Size | 27.0×17.0x4.65 |
P/N | 288BGA |
Pitch | 0.35mm |
Device Spec. | 288FBGA-14.0X14.0X0.76T |
Socket Size | 27.0×17.0x3.75 |
P/N | 546BGA |
Pitch | 0.3mm |
Device Spec. | 546FBGA-14.0X16.0X0.76T |
Socket Size | 27.0×17.0x3.15 |
P/N | 266BGA |
Pitch | 0.3mm |
Device Spec. | 266-FBGA-14X14X0.62T |
Socket Size | 27.0×17.0x3.75 |
P/N | 383BGA |
Pitch | 0.4mm |
Device Spec. | 383FBGA-9.0X9.0X1.18T |
Socket Size | 227.0×17.0x5.40 |
P/N | 48TSOP |
Pitch | 0.5mm |
Device Spec. | 48TSOP-1-20.0X12.4X1.20T |
Socket Size | 28.4×19.0x4.75 |
LEENO’s 100% in-house manufacturing process provides our customers with the best quality & fast delivery.
From Precision Machining to Injection (Molding), Plating/Coating, and Assembly, our Total Manufacturing Processes provides the highest quality products with the shortest production/delivery time to ensure customer satisfaction.