Memory Device Test Socket
With advanced precision injection molding equipment & patented technologies, LEENO can provide various test sockets for all kinds of memory devices.
Specifications
- Package Type
- BGA, TSOP etc.
- Pitch
- ≥0.27mm
- Socket Type
- GPS (Device Alignment System), Floating Type, Hybrid BK Type
PRODUCT SERIES
Package Type
BGA
Pitch(mm)
0.40
Socket Type
Floating Type
Package Type
BGA
Pitch(mm)
0.35
Socket Type
GPS Type / Guide Type
Package Type
BGA
Pitch(mm)
0.30
Socket Type
Hybrid BK Type / Device Guide Type
Package Type
BGA
Pitch(mm)
0.30
Socket Type
GPS Type / Guide Type
Package Type
BGA
Pitch(mm)
0.40
Socket Type
Floating Type / Device Guide Type
Package Type
TSOP
Pitch(mm)
0.50
Socket Type
Nand Flash Memory