Offers test sockets for use on a wide range of packages (i.e., BGA, LGA, QFN, QFP, CSP, TSOP, SOP) and PoP; can be used for Multi-Parallelism, a total solution for the logic test socket.
Package Type | 16LGA |
Pitch | 0.5mm |
Characteristics | 8 Parallel Manual Test |
Package Type | 100QFP |
Pitch | 0.5mm |
Characteristics | Kelvin Contact Test |
Package Type | 251BGA |
Pitch | 0.4mm |
Characteristics | Standard |
Package Type | 1745BGA |
Pitch | 1.0mm |
Characteristics | Air Coaxial 50Ω Matching |
Package Type | 1249NSP |
Pitch | 0.568mm |
Characteristics | Normal |
Package Type | 1292BGA, 272BGA |
Pitch | 0.4mm |
Characteristics | Bi-directional PoP Test Socket |
Package Type | 1296BGA, 361BGA |
Pitch | 0.4mm |
Characteristics | Adjoining PKG Test Socket |
Package Type | 2021BGA |
Pitch | 1.0mm |
Characteristics | 270W Cooling System Cover |
LEENO’s 100% in-house manufacturing process provides our customers with the best quality & fast delivery.
From Precision Machining to Injection (Molding), Plating/Coating, and Assembly, our Total Manufacturing Processes provides the highest quality products with the shortest production/delivery time to ensure customer satisfaction.