Logic Test Socket

Offers test sockets for use on a wide range of packages (i.e., BGA, LGA, QFN, QFP, CSP, TSOP, SOP) and PoP; can be used for Multi-Parallelism, a total solution for the logic test socket.

Specifications

Package Type
FBGA, PoP, QFN, QFP, SOP etc.
Available pitch
0.25P~
Characteristics
AP-Memory Bi-directional Test 0.4P Impedance Matching Coaxial Structure

Product Series

Customized Solution for your needs

LEENO’s 100% in-house manufacturing process provides our customers with the best quality & fast delivery.

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100% In-house Manufacturing

From Precision Machining to Injection (Molding), Plating/Coating, and Assembly, our Total Manufacturing Processes provides the highest quality products with the shortest production/delivery time to  ensure customer satisfaction.