Memory Test Socket

고성능의 정밀 사출 장비와 특허된 기술을 통하여, 다양한 패키지 영역, 테스트 환경에 적합한 메모리 소켓 솔루션을 제공합니다.

Specifications

Package Type
BGA, TSOP etc.
Pitch
0.30P~
Customizing
GPS (Device Alignment System), Floating Type, Hybrid BK Type

Product Series

Customized Solution for your needs

Leeno’s 100% in-house manufacturing process provides our customers with the best quality & fast delivery.

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Total interface solution

From Precision Machining to Injection (Molding), Plating/Coating, and Assembly, our Total Manufacturing Processes provides the highest quality products with the shortest production/delivery time to  ensure customer satisfaction.