Memory Test Socket

고성능의 정밀 사출 장비와 특허된 기술을 통하여, 다양한 패키지 영역, 테스트 환경에 적합한 메모리 소켓 솔루션을 제공합니다.


Package Type
BGA, TSOP etc.
GPS (Device Alignment System), Floating Type, Hybrid BK Type

Product Series

Customized Solution for your needs

Leeno’s 100% in-house manufacturing process provides our customers with the best quality & fast delivery.

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Total interface solution

From Precision Machining to Injection (Molding), Plating/Coating, and Assembly, our Total Manufacturing Processes provides the highest quality products with the shortest production/delivery time to  ensure customer satisfaction.