Logic Test Socket

다양한 종류의 패키지(BGA, LGA, QFN, QFP, CSP, TSOP, SOP)에 적합한 테스트 소켓과 PoP, 멀티 사이트 테스트 소켓 등 로직 테스트에 대한 종합적인 솔루션을 제공합니다.

Specifications

Package Type
FBGA, POP, QFN, QFP, SOP etc.
Available pitch
0.25P~
Characteristics
AP-Memory Bi-directional Test 0.4P Impedance Matching Coaxial Structure

Product Series

Customized Solution for your needs

Leeno’s 100% in-house manufacturing process provides our customers with the best quality & fast delivery.

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Total interface solution

From Precision Machining to Injection (Molding), Plating/Coating, and Assembly, our Total Manufacturing Processes provides the highest quality products with the shortest production/delivery time to  ensure customer satisfaction.