Memory Test Socket

Using advanced precision injection molding equipment and patented technology, LEENO can provide molded sockets for various package sizes for memory sockets.


Package Type
BGA, TSOP etc.
GPS (Device Alignment System), Floating Type, Hybrid BK Type

Product Series

Customized Solution for your needs

LEENO’s 100% in-house manufacturing process provides our customers with the best quality & fast delivery.

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100% In-house Manufacturing

From Precision Machining to Injection (Molding), Plating/Coating, and Assembly, our Total Manufacturing Processes provides the highest quality products with the shortest production/delivery time to  ensure customer satisfaction.